Company Introduction :

Manufacturer of HDI、CSP、RF modules、Media modules、PBGAplastic ball grid array package、Chip Scale Package、Ball Grid Array、System In Package、Embedded Passive Product.

Main Products :

HDI、CSP、RF modules、Media modules、PBGAplastic ball grid array package、Chip Scale Package、Ball Grid Array、System In Package、Embedded Passive Product.

Other Information :

Business Nature :	Manufacturer, Importer, Exporter, Trader
Year Established :	1990/01/25
Company Capital :	USD 100,000,001 ~
Annual Revenue :	USD 100,000,001 ~
No. of Total Staff :	N/A
Current Export Markets :	Worldwide
Trade Term :	FOB
Shipment :	Sea
Currency :	USD
Negotiable :	Negotiable