Company Introduction :

The company's products including wafer bumping, tape carrier packaging (TCP), flip chip, wafer level CSP, gold bump, solder bump, chip on film.

Main Products :

electronic & electrical components- wafer bumping, tape carrier packaging ( TCP), flip chip, wafer level CSP, gold bumps, solder bumps, chip on films.

Other Information :

Business Nature :	Manufacturer
Year Established :	1997
Company Capital :	USD 100,000,001 ~
Annual Revenue :	USD 100,000,001 ~
President :	Mr. Fei Jian Wu
No. of Total Staff :	2001 ~ 3000
Current Export Markets :	Worldwide
Trade Term :	FOB
Shipment :	Sea
Currency :	USD
Negotiable :	Negotiable