Manufacturer of electronic materials, such as coverlay(CL), flexible copper cladded laminate (FCCL), coating, chip on film (COF), photo-imaginable-coverlay (PIC), adhesiveless- FCCL (2L-FCCL), chip on glass (COG), tape automatic bonding (TAB) for flexible printed circuit (FPC).
electronic materials- coverlay ( CL ), flexible copper cladded laminate ( FCCL ), coating, chip on film(COF), photo-imaginable-coverlay ( PIC ), adhesiveless- FCCL ( 2L- FCCL ), chip on glass ( COG ), tape automatic bonding
( TAB ) for flexible printed circuit ( FPC ).
Business Nature : | Manufacturer |
---|---|
Year Established : | 1997 |
Company Capital : | USD 0 ~ 1,000,000 |
Annual Revenue : | USD 0 ~ 1,000,000 |
President : | Mr. Da Wen Sun |
No. of Total Staff : | 1 ~ 50 |
Current Export Markets : | Worldwide |
Trade Term : | FOB |
Shipment : | Sea |
Currency : | USD |
Negotiable : | Non-negotiable |