Special very Lowprofile and small size design, Wound chip construction with standard 0805 or 0603 size, with best EMI suppression effect at higher frequency 500MHz~up. And least impact to signal wave form.
Preventive measure against high speed signal radiation emissions such as USB 2.0, IEEE1394 or LAN interface. Best for NB, DSC, mobile device design.
Please refer to the attached film.