Description :

1. We produce full range of solder ball.
2. BGA technology can bring higher performance, quality and capacity to your radiation as well as reducing the size of product.
3. Solder ball technology will replace traditional pin -through -hole technology to enhance your yield-rate of production.
4. Feature:
(1) Without fluorescence.
(2) Automation and clean room operations production lines are in the clear room that are under the condition of class 10000, temperature: 23± 2C & humidity 55± 5%.
(3) 100% of inspection to ensure produces consistence to customer’s quality criteria.

Specification :

1. BGA solder ball are made with high purity and quality raw material and been inspected by spectrometer. 2. Composition: (1) Lead: Sn63/Pb37 (can be change by your request) (2) Lead free: [95.5Sn/4.0Ag/0.5Cu] ~ [95.2Sn/3.8Ag/0.5Cu], [96.5Sn/3.5Ag] ~ [99.35Sn/0.6Cu-0.05Ni]. 3. Specification ( ball size / tolerance): (1) 889mm: ±0.020. (2) 76mm: ±0.020. (3) 64mm: ±0.020. (4) 60mm: ±0.020. (5) 55mm: ±0.020. (6) 50mm: ±0.015. (7) 45mm: ±0.015. (8) 40mm: ±0.015. (9) 35mm: ±0.010. (10) 30mm: ±0.010. (11) 25mm: ±0.010. (12) 20mm: ±0.005. (13) 15mm: ±0.005. (14) 10mm: ±0.005. (15) 09mm: ±0.005. (16) 08mm: ±0.005.