Joen Lih Machinery Co., Ltd.
Tel:886-4-25349475 Fax:886-4-25339001
Address:No.240-1, Sec. 1, Dafeng Rd., Tantzu Dist., Taichung City 427, Taiwan
Detail Information
Description :
The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding machine performs vertical grinding on hard and brittle workpieces requiring rigorous surface accuracy and flatness. One evident example is the use of water surface grinding during semi-conductor processes. This process will decide the minimum sizes for wafer sealing and system sealing. In fact, the rigorous requirements for surface flatness and roughness in wafer surface grinding can be achieved only by a specially designed wafer grinding machines.
The machine employs an air floating spindle fitted with a diamond grinding wheel - the water is sucked onto an air floating table.
Specification :
| Items | JL- 200 SCG | |
| Max grinding capacity | Workpiece Diameter | Ø 200 mm |
| Spindle | Type | Aerostatic |
| Spindle Number | 1 | |
| Motor | 3.7 kw | |
| Spindle speed | 1000-5000 rpm | |
| Tool | Ø 250 mm Diamond wheel | |
| Z Axis | Travel | 120 mm |
| Feed Resolution | 0.1 µ m | |
| Rapid Traverse | 300 mm/min | |
| Table | Type | Aerostatic |
| Table Number | 1 | |
| Speed | 0-500 rpm | |
| Thickness gauge (Optional) | Measuring Range | 0-1000 µ m |
| Resolution | 0.1 µ m | |
| Repeatability accuracy | ± 0.5 µ m | |
| Weight | Machine weight | 2000 kg |
| Dimensions | Machine space | 600(W)x1700(D)x2100(H) mm |
| Machining accuracy | TTV | 3µ m |
| Surface Roughness | Ra 0.02 µ m | |
| Floor space | L x W(incl. Peripheral Equip.) | 3000(L) x 2500(W) mm |
Joen Lih Machinery Co., Ltd.
- Taiwan
- No.240-1, Sec. 1, Dafeng Rd., Tantzu Dist., Taichung City 427, Taiwan
- 886-4-25349475
- 886-4-25339001