Joen Lih Machinery Co., Ltd.

Tel:886-4-25349475       Fax:886-4-25339001
Address:No.240-1, Sec. 1, Dafeng Rd., Tantzu Dist., Taichung City 427, Taiwan


High Precision CNC Profile Surface Grinding Machine


  • Model No: JL-200SCG
  • Factory Location: Taiwan
  • Sample Request: No
  • Target Markets: Worldwide

Detail Information

Description :

The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding machine performs vertical grinding on hard and brittle workpieces requiring rigorous surface accuracy and flatness. One evident example is the use of water surface grinding during semi-conductor processes. This process will decide the minimum sizes for wafer sealing and system sealing. In fact, the rigorous requirements for surface flatness and roughness in wafer surface grinding can be achieved only by a specially designed wafer grinding machines.
The machine employs an air floating spindle fitted with a diamond grinding wheel - the water is sucked onto an air floating table.

Specification :

ItemsJL- 200 SCG
Max grinding capacityWorkpiece DiameterØ 200 mm
Spindle Number1
Motor3.7 kw
Spindle speed1000-5000 rpm
ToolØ 250 mm Diamond wheel
Z AxisTravel120 mm
Feed Resolution0.1 µ m
Rapid Traverse300 mm/min
Table Number1
Speed0-500 rpm
Thickness gauge
Measuring Range0-1000 µ m
Resolution0.1 µ m
Repeatability accuracy± 0.5 µ m
WeightMachine weight2000 kg
DimensionsMachine space600(W)x1700(D)x2100(H) mm
Machining accuracyTTV3µ m
Surface RoughnessRa 0.02 µ m
Floor spaceL x W(incl. Peripheral Equip.)3000(L) x 2500(W) mm

Joen Lih Machinery Co., Ltd.

  • Taiwan
  • No.240-1, Sec. 1, Dafeng Rd., Tantzu Dist., Taichung City 427, Taiwan
  • 886-4-25349475
  • 886-4-25339001
  • 657255451