657444022

Long Automatic Machinery Co., Ltd.

Taiwan Manufacturers, Exporters.

All Products

Array Manual Loading Machine
  • Model No:
    LGSA-31
  • Product Description:
    1. Set the Lord Plate in the Loading Machine and then put the chips into the Lord Plate
    2. Start the switch for vibration, and also shaking/vibrating this machine by labor to complete the loading process.
Semi Auto Tapping Machine For SUS
  • Model No:
    LGTC-130-M-1
  • Product Description:
    Using trampling switch to start motor and drive the rubber wheel rotation first, and then push SUS Plate one by one by hand to stick with tapes.
Array Thin Carrier Plate (ATCP)
  • Model No:
    LGDL_LGDM
  • Product Description:
    Application: Hold chips
Unload Plate
  • Model No:
    LGCEA
  • Product Description:
    1.Application:
    ①. Unloading the chips of completed dipping
    ②. Collecting the chips of completed dipping
Top Pin Plate, ATCP
  • Model No:
    LGPPA
  • Product Description:
    Application: Unloading the chips of completed dipping
Bottom Level Plate
  • Model No:
    LGPDA
  • Product Description:
    Application: Set up under the bottom of Level Air Press leveling chips.
Top Level Plate
  • Model No:
    LGPTA
  • Product Description:
    Application: Set upon the Level Air Press for leveling chips.
Unload Cover Plate
  • Model No:
    LGCDA
  • Product Description:
    Application: for loading chips
Unload Plate
  • Model No:
    LGCBA
  • Product Description:
    Application: for unloading chips.
ATCP Transfer Plate
  • Model No:
    LGRPA
  • Product Description:
    Application: This ATCP Transfer Plate helps chips transferring to un-dipping sid
Array Press Plate
  • Model No:
    LGPUA
  • Product Description:
    Application: Assembly the Press Plate upon the Bottom Air Press M/C to keep the whole holes positions of Press Plate consistent with holes positions of TCP which will protect the chips not been touched by plate (escape holes).
Bottom Press Conversion
  • Model No:
    LGBAB
  • Product Description:
    Application: This is the interface for chips inserting into the TCP.
Bottom Load Plate
  • Model No:
    LGLAB
  • Product Description:
    Application: Put the chips loading into holes of Bottom Load Plate through Vibration action.
ATCP Vibration Box
  • Model No:
    LGCAA
  • Product Description:
    Application: Put the chips in the Vibration Box first and associated with the Load Plate to let the chips loading into the holes of Load Plate.
ATCP Cassette
  • Model No:
    LGPSA
  • Product Description:
    Application: Storage TCP
ATCP Dipping Vacuum Plate
  • Model No:
    LGVSA
  • Product Description:
    *Application: Using Vacuum Plate to keep the TCP for dipping process.
Level Air Press
  • Model No:
    LGAT-023T-1
  • Product Description:
    *Application: Use the TCP with inserted chips to level or transfer the chips.
    *Operational Process
    1.Put the TCP with inserted chips on the lower Level Plate by labor.
    2.Start the bilateral sensors switch to press the Level Plate down and let the...
Air Press From Bottom
  • Model No:
    LGAT-013T-1
  • Product Description:
    *Application: Inserting the chips into the TCP
    *Operational Process
    1.Set the Lord Plate after completed vibration to put on lower Press Conversion by labor.
    2.Then set the TCP on Lord Plate.
    3.Start the bilateral sensors switch, to push the pin...
Array Semi Auto Vibration Loading Machine
  • Model No:
    LGSA-35
  • Product Description:
    *Application: Lord the chips in the Lord Plate through hand vibration approach.
    *Operational Process
    1.Put the chips in the Vibration Box and then cover the Lord Plate
    2.Set the Vibration Box on embedded in this machine and then swing to load the...
SUS Plate
  • Model No:
    SS1M1-1
  • Product Description:
    Application: for holding chips
LGPDT Level Plate
  • Model No:
    LGPDT
  • Product Description:
    Application:For leveling, making the protrution of chips even. Two types, one type with holes and the other type with no hole. It is fixed on the bottom of the Air Presser for leveling. 整平使用,使晶片凸出量均一。
LGPUT Press Plate
  • Model No:
    LGPUT
  • Product Description:
    Application: Assembly the Press Plate upon the Bottom Air Press M/C to keep the whole holes positions of Press Plate consistent with holes positions of TCP which will protect the chips not been touched by plate (escape holes).
SP3AH Spacer
  • Model No:
    SP3AH/SP3ZA/SP3AI
  • Product Description:
    Application: Put the spacers at both right and left sides under the Top Air Press, and through the Spacers to adjust height and reach the expected value of chips protrusion.
LGVI-8101 Auto Insert Machine
  • Model No:
    LGVI-8101
  • Product Description:
    Application:Insert chips into TCP automatically.

    With related automatic dipping machine, the Auto Insert Machine completes inserting action automatically.

    The Auto Insert Machine inserts chips into the holes of the load plate through automatic...
LGCBT Unload Plate
  • Model No:
    LGCBT
  • Product Description:
    Application: Put the Unload Plate under the Top Air Press for inserting, transferring and unloading chips.
LGHPT Support Plate
  • Model No:
    LGHPT
  • Product Description:
    Application: Support the TCP
Pins
  • Model No:
    SP4AZ/SP4ZZ
  • Product Description:
    Application: Assembly the Pins in the Press Conversion for inserting, leveling, transferring and unloading chips
LGCAT Vibration Box
  • Model No:
    LGCAT
  • Product Description:
    Application: Put the chips into the Vibration Box, and inserting them into holes of Load Plate
LGPST TCP Cassette
  • Model No:
    LGPST
  • Product Description:
    Application: Storage TCP
LGVST Dipping Vacuum Plate
  • Model No:
    LGVST
  • Product Description:
    Application: Lock and fix under Level Press for leveling to let the protrusion height consistency.
Vacuum Vibration Loading Machine
  • Model No:
    LGSW-100-LV-220-1
  • Product Description:
    Application:for Loading

    Operational Process:
    1.Put the Vibration box on machine by labor and collocate with Vibration box and Load Plate.
    2.Use vacuum with shaking approach to put chips into Load Plate and then save the operational time of Chip...
Non-Vacuum Vibration Loading Machine
  • Model No:
    LGSW-100-L-220-1
  • Product Description:
    * Operational Process
    1. Put the Vibration box on machine by labor and collocate with Vibration box and Load Plate.
    2. Use vacuum with shaking approach to put chips into Load Plate and then save the operational time of Chip loading.

    * Associate...
LGVI-180280 Loading Machine Through Shaking
  • Model No:
    LGVI-180280
  • Product Description:
    Application:for Loading, suitable 0201 and small chips
LGAT-003T Air Press Of Chip Loading From Up
  • Model No:
    LGAT-003T
  • Product Description:
    Application:Chips inserting into TCP and then transferring and unloading.
LGAT-013T Air Press Of Chip Loading From Bottom
  • Model No:
    LGAT-013T
  • Product Description:
    Application:Chips inserting into TCP
LGAT-023T Level Air Press
  • Model No:
    LGAT-023T
  • Product Description:
    Application:Chips inserting into TCP and then leveling or transferring.
LGTT-8102 Auto Transfer Machine
  • Model No:
    LGTT-8102
  • Product Description:
    Application:Transfer chips to the other side automatically, and then level chips.
    TCP can be positioned precisely on the transportation track.
LGTM-6168 TCP Auto Dipping Machine
  • Model No:
    LGTM-6168
  • Product Description:
    Application:for chips terminal dipping of passive components
    Carrier:Thin Carrier Plate series, TCP
    Chips:0201, 0402, 0603, 0805 and above
    Capacity:Depends on chips’ specification which will affect capacity. For example, the capacity of chip 04...
LGTM-6110 TCP Manual Dipping Machine
  • Model No:
    LGTM-6110
  • Product Description:
    Application:for chips terminal dipping of passive components
    Carrier:Thin Carrier Plate series, TCP
    Chips:0201, 0402, 0603, 0805 and above
    Capacity:Depends on chips’ specification which will affect capacity. For example, the capacity of chip 04...
LGTM-6621 TCP Automatic Dipping Machine
  • Model No:
    LGTM-6621
  • Product Description:
    Application:for chips terminal dipping of passive components
    Carrier:Thin Carrier Plate series, TCP
    Chips:0201, 0402, 0603, 0805 and above
    Capacity:Depends on chips’ specification which will affect capacity. For example, the capacity of chip 04...
LGTM-6610 TCP Automatic Dipping Machine
  • Model No:
    LGTM-6610
  • Product Description:
    Application:for chips terminal dipping of passive components
    Carrier:Thin Carrier Plate series, TCP
    Chips:0201, 0402, 0603, 0805 and above
    Capacity:Depends on chips’ specification which will affect capacity. For example, the capacity of chip 04...
TCP Automatic Loading And Unloading Dipping Machine
  • Model No:
    LGTM-6191
  • Product Description:
    1. Application: for chips terminal dipping of passive components
    2. Carrier: Thin Carrier Plate series, TCP
    3. Chips: 0201、0402、0603、0805 and above
    4. Capacity: Depends on chips’ specification which will affect capacity. For example, the capacity ...
Array Dipping Machine
  • Model No:
    LGTM-3968
  • Product Description:
    1. Application: Suitable for array dipping in MLCC, MLCI, MLV, LTCC, LICC, etc.
    2. Features: Array Thin Carrier Plate (ATCP). The main material is stainless steel and silicon. Light and thin, cooling fast, high capacity, low cost, no pollution, high...
Auto Inserting And Leveling Machines
  • Model No:
    LGVI-8216
  • Product Description:
    Lower implanted press body:
    1. Use gas-hydraulic cylinder with the maximum working pressure of 1,800 kg, hydraulic stroke 15mm, and a total stroke of 120mm.
    2. With a needle bed, needle bed spec changes according to the size of chips and number of ...
Auto Harvesting Machines For TCP
  • Model No:
    LGTU-8300
  • Product Description:
    Function:
    1. Place silver-dipped thin carrier plate cartridge storage at feeding section and transfer thru transportation agencies to pressure-bed to proceed with the unloading action.
    2. Thin carrier plate that has completed unloading, thru transp...
Array Termination Machines
  • Model No:
    LGTM-3910
  • Product Description:
    Function:
    1. Function of support suction plate:
    (1) Support suction plate has one vacuum generator, so that it can suck the TCP.
    (2) There are two locating pin to locate TCP. The chips are hold through the diamond holes, so their position is no ne...
Press Conversions
  • Model No:
    LGBTT/LGBTB
  • Product Description:
    1. Explanation: assembled on the air press and for the uses of loading, transferring, and unloading chips.
    2. It is determined by the chip size, carrier plate, and different chip loading method.
Load Plates
  • Model No:
    LGLTT/ LGLTB
  • Product Description:
    1. Explanation: lead the chips into the holes of the load plate, and use the air press to load the chips on the carrier plate.
    2. Specification: custom-made dimensions are possible on request.
Steel Belts
  • Model No:
    N/A
  • Product Description:
    1. Use: place and spread silver paste.
    2. Suitable for LGTM-2009.
    3. Dimension: 356x1829x0.25t(mm).
    4. Code No.: LGTM-RS-1472-A.
Thin Carrier Plates
  • Model No:
    LGTP
  • Product Description:
    1. LONG's thin carrier plate is a brand-new tool for dipping which can be used successfully to handle a variety of chip components such as MLCC, MLCI etc. The thin carrier plate, which is created by LONG, is designed to combine both the advantage...
TCP Semi Auto Dipping Machine
  • Model No:
    LGTM-6130
  • Product Description:
    1. Application: for chips terminal dipping of passive components
    2. Carrier: Thin Carrier Plate series, TCP
    3. Chips: 0201, 0402, 0603, 0805 and above
    4. Capacity: Depends on chips’ specification which will affect capacity. For example, the capaci...
Carrier Plates
  • Model No:
    LTSP
  • Product Description:
    production and sales service of automatic equipments for passive components, MLCC, chip inductors, chip resistors, TAB flexible printed circuit, semiconductor optoelectronics, lead frame and peripheral tooling.