1. Purpose: wafer, OLED deposition fixture.
2. Production capability.
3. Min. bore diameter-50μm.
4. Min. bore distance-70μm.
5. Max. size-600x700mm.
Available materials(still have other metal alloy metal)- 1. SUS304 T=0.03, 0.05, 0.06, 0.08, 0.1, 0.15, 0.2mm. 2. Alloy36 T=0.05, 0.1mm. 3. SUS430 T=0.1, 0.25, 0.4mm.