Founded in 2002, ChipSiP has been building its core brand value of “Chip of SiP” to shape a smart lifestyle teems with portable technology by creating miniaturization chips. ChipSiP provides comprehensive turnkey SiP solutions utilizing chip package design to optimize the tiniest, easy-to-implement Memory, Logic and Wireless SiP for the market trend of being lighter and slimmer. With ChipSiP’s “SiP customization standardization” process, the accumulated sales have reached 30 million units from digital camera, camcorder and cell phone. ChipSiP will continue its effort on cutting-edge SiP products and brand added service to broaden the value of SiP both in the marketplace and industry chain. To realize the desire into future life, ChipSiP is dedicated to driving the core engine of SiP technology to bring a smart life ahead of you. For further information, please visit www.chipsip.com.
We are not only the first to market with a major SiP miniaturization solution in Taiwan, but also a global leading brand in defining Memory SiP specification for digital cameras. As well, we are also the world' first-to-market with combo NAND Flash, DDR/DDR2, and DDR2 SDRAM x 32-bit by 4-stacked chip.
Contribution to our clients: minimizing circuits and embedding functions into a small chip.
Contribution to consumers: enjoying the convenience and smart life ahead via our SiP products.
Driving the core engine of SiP technology, and bringing the smart life on the go.
Manufacture of electrical and electronic components include (1) memory SiP: NAND flash + DDR2 SDRAM, DDR2 stack, NOR flash + pSRAM, NAND flash + M-SDRAM / M- DDR SDRAM, NOR flash / NAND flash + SDRAM, memory MCP, DSC/DV MCP, mobile phone MCP, smart phone MCP, module MCP, portable media players MCP, personal information devices MCP, handheld PCs MCP, multimedia phones/ DVB MCP. (2) SiP ODM: logic SiP, RF SiP, customized design, and so on.