* State-of-the-Art Technology
* Ultra High Positioning Accuracy: +/- 2 um
* Controller of Super Fine Resolution: 0.1 um
* Window 2000® Control platform with 15" Touch Panel LCD.
* Wire Electrical Discharge Grinding equipment (WEDG)
* Offers extraordinary grinding performance, the electrode diameter can less than 0.02 mm.
* High Precision Micro Multi-Hole Machining
* The 3000 rpm highly balanced ultra precision spindle provides outstanding hole drilling and shaping features, the optimum hole diameter can be 0.03 mm.
|Travel (X x Y x Z)||200 x 150 x 150 mm|
|Controller Minimum Resolution||0.1 μm|
|Electrode Forming Size (min.)||20 μm|
|Minimum Hole Diameter||30 μm|
|Surface Roughness||0.15 μm Ra|
|Workpiece Weight (max.)||30 Kg|
|Space Occupied||1400 x 1000 x 1700 mm|
|Due to continuous research and development, all specications and design characteristics are subject to change without prior notice.|
*All the specifications are subject to change without prior notice.