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Features of Design-

WSG series - Wafer thinning & grinding machine

Mainly applied for oxide wafer, reclaim wafer, dummy wafer or process wafer substrates pre-processing in speedy thinning & glue-removing grinding, such as silicon, quartz, LiNbO3 / LiTNO3, Ge and SiC material.
• Smart programmable PLC/HMI provides simplified operation for users.
• The diamond dresser of top grinding tray is equipped with optical linear scales to provide orientation of high accuracy.
• Distinctive design of feeding compensation control for grinding spindle provides a speedy shear rate and high precision of thickness control
• Distinctive design of anti-tremble balanced device provides a lower shear tolerance of workpiece
• Patented supersonic micro-vibration unit enables to promote speedy grinding rate for workpiece further.
• Bottom holding tray is equipped with vacuum suction device sustains good anti-slippery under working status.
• Additional high-precision thickness gauge can be equipped onto cantilever device with D/D servo-motor.
• Automatic load/unload manipulating device is available for optional as per requests.



Domino specialized in lapping & polishing machine/ CNC processing machines/ Custom automated processing equipment and auxiliaries.
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