Content :

As 5G mobile phones become more integrated, mobile phone motherboard upgrades are imperative. The device usage in 5G mobile phones has increased significantly, and the increase in integration has brought motherboard upgrades, prompting the upgrade of ordinary HDI to Anylayer HDI and SLP (Substrate-LikePCB).



While electronic design is constantly improving the overall performance, it is also striving to reduce its size. From small mobile phones to smart portable small portable products, "small" is always the pursuit. High-density integration (HDI) technology enables smaller end product designs while meeting higher standards for electronic performance and efficiency. HDI is widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used.



   


                                        Specifications: 





                                                        Material: FR4


                                                        Layer: 8L


                                                        Copper thickness: 1OZ


                                                        Board thickness: 1.6mm


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