Content :

HDI circuit advantages
Can reduce PCB cost: When the density of the PCB increases by more than eight layers, the cost will be lower than that of the traditional complicated lamination process.
Increased circuit density: interconnection of traditional circuit boards and parts
Conducive to the use of advanced construction technology
Have better electrical performance and signal accuracy
Better reliability
May improve thermal properties
Can improve RFI / EMI / ESD (RFI / EMI / ESD)
Increase design efficiency



   


                                        Specifications: 





                                                        Material: FR4


                                                        Layer: 12L


                                                        Copper thickness: 1OZ


                                                        Board thickness: 3.2mm


                                                        Surface
Finishing: Immersion gold


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