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With the development of portable product design in the direction of miniaturization and high density, the difficulty of PCB design is becoming greater and greater, placing higher requirements on the production process of PCB. In most portable products, the BGA package with a pitch of 0.65mm or less uses a blind buried via design process, so what is a blind buried hole?
Blind holes: Blind vias are the type of vias that connect the inner wiring of the PCB to the surface wiring of the PCB. This hole does not penetrate the entire board.
Buried holes: Buried vias only connect vias between inner layers, so they are not visible from the PCB surface.



HDI is the English abbreviation for High Density Interconnector. High-density interconnect (HDI) manufacturing is one of the fastest growing areas in the printed circuit board industry. From the first 32-bit computer from HP in 1985 to the large client server with 36 sequential multi-layer printed boards and stacked micro-vias, HDI/mini via technology is undoubtedly the future PCB architecture. Smaller ASICs and FPGAs with smaller device spacing, I/O pins, and embedded passives have shorter rise times and higher frequencies, all of which require smaller PCB feature sizes, which drives Strong demand for HDI/mini vias.
HDI process
First-order process: 1+N+1
Second-order process: 2+N+2
Third-order process: 3+N+3
Fourth-order process: 4+N+4



   


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                                                        Material: FR4


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