( Origin : Taiwan Manufacturer & Supplier )
Tong Hsing is the professiional manufacturer in microelectronic module Packaging - MEMS assembly, MEMS Packaging, ceramic circuit substrate, hybrid substrate, ceramic thick film substrate, thick film substrate, available substrate technology, substrate manufacturing services, thick film substrate manufacturing, outsourced substrate technology, LTCC ( low temperature co fire ceramic), laminate, thin film on copper lead frame technology, assembly Packaging services, SMT, COB, C4 & GGI flip chip ( controlled collapse chip connection), gold interconnections, back end technology, backend operations, wafer grinding & dicing, IC Packaging service, semiconductor IC testing, IC Test service, IC assembly Packaging,...
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