: Precision Etching
1. Purpose: Precision serve. 2. Production capability. 3. Min. bore diameter-50μm. 4. Min. bore distance-70μm.
1. Purpose: wafer, OLED deposition fixture. 2. Production capability. 3. Min. bore diameter-50μm. 4. Min. bore distance-70μm. 5. Max. size-600x700mm.
1. Mesh, cellular phone buttons, SMT printing steel plate, lead frame, and other high Precision Etching products for research institutes. 2. Purpose: can be customized. 3. Min. bore diameter-50μm. 4. Min. bore distance-70μm. 5. Max. size-650x730mm.
1. Mesh, cellular phone buttons, SMT printing steel plate, lead frame, and other high Precision Etching products for research institutes. 2. Purpose: can be customized. 3. Min. bore diameter-50μm. 4. Min. bore distance-70μm. 5. Max. size-650x730mm.
1. Mesh, cellular phone buttons, SMT printing steel plate, lead frame, and other high Precision Etching products for research institutes. 2. Purpose: can be customized. 3. Min. bore diameter-50μm. 4. Min. bore distance-70μm. 5. Max. size-650x730mm.
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