Chipbond Technology Corporation

Manufacturer of Solder Bumps.

Taiwan

Company Introduction

The company's products including wafer bumping, tape carrier packaging (TCP), flip chip, wafer level CSP, gold bump, solder bump, chip on film.

Main Products

electronic & electrical components- wafer bumping, tape carrier packaging ( TCP), flip chip, wafer level CSP, gold bumps, solder bumps, chip on films.