integrated circuits ( IC design, OEM ODM), SMT, semiconductor manufacturing
, embedded memory and design, wafer fabrication. testing- memory tester,
logic tester, mixed tester, assembly- PLCC, DIP, SKINNY, SOP, SOJ, TSOP, QFP, TQFP, BGA
wafer grinding- 6" wafer-down to 10 mil, 8" wafer-down to 10 mil
, wafer probing (for memory, Logic and mixed ICs)
packaging (QFP, SOP, BGA), and final testing.